Welcome!

@BigDataExpo Authors: Pat Romanski, Elizabeth White, Yeshim Deniz, Carmen Gonzalez, ManageEngine IT Matters

News Feed Item

Coolpad Wins the Honor of "2013-2014 Global Intelligent Interconnection Devices Brands Top 10"

LAS VEGAS, Jan. 9, 2014 /PRNewswire/ -- In the appraisal and selection activity conducted for "2013-2014 Global Intelligent Interconnection Devices Brands Top 10" on January 8, Coolpad was selected as one of the winners due to its outstanding achievement and brand performance of last year. Such activity, jointly created by IDG and IDC, is an international authoritative exchange, display and cooperation platform for global intelligent interconnection equipment brands. (Photo taken onsite: http://cebrands.cn/news.asp?op=read&cate=&ID=106)

In the appraisal and selection activity for "2013-2014 Global Intelligent Interconnection Devices Brands Top 10" which focuses on the leading brand enterprises in the global intelligent interconnection industry, brands of intelligent interconnection devices are evaluated for 2013, mainly based on research data of IDC (an international data investigation and survey authority), according to brand appraisal and selection rules. It is hoped that such activity will help improve mixed ability of sustainable development of global intelligent interconnection equipment industry and sustainable competitiveness of brand. The award list and individual award list were announced during the forty-eighth CES show held in Las Vegas on January 8, 2014. At the scheduled time, a grand award ceremony was held.

Coolpad continues to forge ahead in the mobile internet age

With arrival of big data, smart cloud, mobile internet age, the service field of global intelligent interconnection equipment brand is expanding, and performance of brand products is improved. Facing brand globalization and the situation that the new generation of intelligent interconnection technology sweeping the world, a growing number of brands of intelligent interconnection equipment begin to develop internationally. During the leader summit dialogue of global intelligent terminal held before the award ceremony, Zhang Guangqiang, vice president of Coolpad, entered into the summit dialogue on the theme of "Intelligence Opens up the Future in the Mobile Internet Age", further discussing mixed ability of sustainable development of global intelligent interconnection equipment industry and sustainable competitiveness of brand.

The statistics of IDG show that although the smart phone markets of many countries face saturation, intelligent equipment still help promote market development due to demand of emerging markets for middle and low-end smart phone drives market development, and thus the global intelligent terminal market keeps rapid growth in 2013, with sales volume of the first three quarters exceeding 1 billion, and Chinese brands continue to keep rapid development in the global intelligent terminal market. Coolpad, ZTE, Huawei, and Lenovo (four domestic mainstream smart phone manufacturers) catch the eye of the industry in the world in terms of market share and growth.

Coolpad, the mobile phone enterprise with the strongest growth momentum in China, adheres to give priority to technology development and enhances LTE technical accumulation and breakthrough. It makes integration researches all over the world, establishing seven R&D centers (in Beijing, Xi'an, Hefei, Dongguan, Shenzhen and Nanjing, U.S.) at present. It has a professional R&D team of 2200 persons. At present, Coolpad applies for about 800 patents per year and has 4500 pending patent applications, making it the mobile phone manufacturer with the greatest number of patents in China.

Coolpad display outstanding products in CES

It is understood that, in the forthcoming CES of this year, Coolpad, as one of the leading enterprises in Chinese mobile phone industry, will display ten types of LTE mobile phones and different accessories which support mainstream types of network standard in Europe and America and other countries, and quantity of its product displayed in the show will be about three times larger than those in last year.

The much-anticipated "Coolpad Halo", the world's first smart phone equipped with octa-core processor, will be released on the opening day of CES (January 8). Such product is equipped with 7 inch HD screen, true octa-core processor, 2GB memory, 8GB storage space, microSD card, WCDMA + GSM dual cards dual standby, 13 megapixel camera and other top-level parts, providing perfect performance and customer experience.

Moreover, Coolpad 8970L a high-end flagship 4G mobile phone jointly developed by Coolpad and China Mobile, will be displayed on CES. Such product is equipped with a 5.9 inch 1920 x 1080 FHD retina screen, a new generation of gorilla glass on the surface, 1.8GHz Tegra4 processor, Android 4.2 + CoolLife UI5.0, 13-Megapixel large-aperture camera (ensuring photograph quality), offers Dolby 7.1 HiFi sound quality and 100M network speed, providing "light-speed" experience and ensuring excellent enjoyment in terms of games and entertainment.

Coolpad's 4G leadership

The analysts in the industry said that in order to achieve the strategic objective of 4G leadership in the domestic market, Coolpad adopts an abundant terminal development arrangement. It is estimated that in 2014, it will release over 30 types of LTE products, covering high, middle and low-end product segment, making further progress in the 4G leadership strategy. With regard to the oversee market, Coolpad has already made development arrangement in Asia, North America, Europe and other international markets and sold its products in ten countries and regions including U.S., U.K., France, Germany, Greece, India and Taiwan, achieving overseas sales volume proportion of 10%. The analysts said that Coolpad has already assigned 80% of research technicians to focus on R&D of 4G and reserved considerable quantity of patents and technologies. Precise product mix and the determination of shifting its focus to 4G will create a great opportunity for it to take the lead in the international arena.

Yulong Computer Telecommunications Scientific (Shenzhen) Co., Ltd. ("Coolpad" for short) collaborates with IDG and empowers IDG to release news to oversea media.

 

SOURCE IDG China

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@BigDataExpo Stories
SYS-CON Events announced today that CollabNet, a global leader in enterprise software development, release automation and DevOps solutions, will be a Bronze Sponsor of SYS-CON's 20th International Cloud Expo®, taking place from June 6-8, 2017, at the Javits Center in New York City, NY. CollabNet offers a broad range of solutions with the mission of helping modern organizations deliver quality software at speed. The company’s latest innovation, the DevOps Lifecycle Manager (DLM), supports Value S...
SYS-CON Events announced today that Systena America will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Systena Group has been in business for various software development and verification in Japan, US, ASEAN, and China by utilizing the knowledge we gained from all types of device development for various industries including smartphones (Android/iOS), wireless communication, security technology and IoT serv...
SYS-CON Events announced today that Super Micro Computer, Inc., a global leader in compute, storage and networking technologies, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Supermicro (NASDAQ: SMCI), the leading innovator in high-performance, high-efficiency server technology, is a premier provider of advanced server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/...
SYS-CON Events announced today that Peak 10, Inc., a national IT infrastructure and cloud services provider, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Peak 10 provides reliable, tailored data center and network services, cloud and managed services. Its solutions are designed to scale and adapt to customers’ changing business needs, enabling them to lower costs, improve performance and focus intern...
A strange thing is happening along the way to the Internet of Things, namely far too many devices to work with and manage. It has become clear that we'll need much higher efficiency user experiences that can allow us to more easily and scalably work with the thousands of devices that will soon be in each of our lives. Enter the conversational interface revolution, combining bots we can literally talk with, gesture to, and even direct with our thoughts, with embedded artificial intelligence, whic...
The 21st International Cloud Expo has announced that its Call for Papers is open. Cloud Expo, to be held October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, brings together Cloud Computing, Big Data, Internet of Things, DevOps, Digital Transformation, Machine Learning and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding busin...
SYS-CON Events announced today that Enzu will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY, and the 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Enzu’s mission is to be the leading provider of enterprise cloud solutions worldwide. Enzu enables online businesses to use its IT infrastructure to their competitive ad...
Everywhere we turn in our industry we can find strong opinions about the direction, type and nature of cloud’s impact on computing and business. Another word that is used in every context in our industry is “hybrid.” In his session at 20th Cloud Expo, Alvaro Gonzalez, Director of Technical, Partner and Field Marketing at Peak 10, will use a combination of a few conceptual props and some research recently commissioned by Peak 10 to offer a real-world consideration of how the various categories of...
In his opening keynote at 20th Cloud Expo, Michael Maximilien, Research Scientist, Architect, and Engineer at IBM, will motivate why realizing the full potential of the cloud and social data requires artificial intelligence. By mixing Cloud Foundry and the rich set of Watson services, IBM's Bluemix is the best cloud operating system for enterprises today, providing rapid development and deployment of applications that can take advantage of the rich catalog of Watson services to help drive insigh...
When NSA's digital armory was leaked, it was only a matter of time before the code was morphed into a ransom seeking worm. This talk, designed for C-level attendees, demonstrates a Live Hack of a virtual environment to show the ease in which any average user can leverage these tools and infiltrate their network environment. This session will include an overview of the Shadbrokers NSA leak situation.
SYS-CON Events announced today that SoftLayer, an IBM Company, has been named “Gold Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. SoftLayer, an IBM Company, provides cloud infrastructure as a service from a growing number of data centers and network points of presence around the world. SoftLayer’s customers range from Web startups to global enterprises.
Multiple data types are pouring into IoT deployments. Data is coming in small packages as well as enormous files and data streams of many sizes. Widespread use of mobile devices adds to the total. In this power panel at @ThingsExpo, moderated by Conference Chair Roger Strukhoff, panelists will look at the tools and environments that are being put to use in IoT deployments, as well as the team skills a modern enterprise IT shop needs to keep things running, get a handle on all this data, and deli...
DevOps is often described as a combination of technology and culture. Without both, DevOps isn't complete. However, applying the culture to outdated technology is a recipe for disaster; as response times grow and connections between teams are delayed by technology, the culture will die. A Nutanix Enterprise Cloud has many benefits that provide the needed base for a true DevOps paradigm.
With major technology companies and startups seriously embracing Cloud strategies, now is the perfect time to attend @CloudExpo | @ThingsExpo, June 6-8, 2017, at the Javits Center in New York City, NY and October 31 - November 2, 2017, Santa Clara Convention Center, CA. Learn what is going on, contribute to the discussions, and ensure that your enterprise is on the right path to Digital Transformation.
SYS-CON Events announced today that WineSOFT will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Based in Seoul and Irvine, WineSOFT is an innovative software house focusing on internet infrastructure solutions. The venture started as a bootstrap start-up in 2010 by focusing on making the internet faster and more powerful. WineSOFT’s knowledge is based on the expertise of TCP/IP, VPN, SSL, peer-to-peer, mob...
SYS-CON Events announced today that EARP Integration will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. EARP Integration is a passionate software house. Since its inception in 2009 the company successfully delivers smart solutions for cities and factories that start their digital transformation. EARP provides bespoke solutions like, for example, advanced enterprise portals, business intelligence systems an...
SYS-CON Events announced today that delaPlex will exhibit at SYS-CON's @CloudExpo, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. delaPlex pioneered Software Development as a Service (SDaaS), which provides scalable resources to build, test, and deploy software. It’s a fast and more reliable way to develop a new product or expand your in-house team.
SYS-CON Events announced today that Carbonite will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Carbonite protects your entire IT footprint with the right level of protection for each workload, ensuring lower costs and dependable solutions with DoubleTake and Evault.
SYS-CON Events announced today that Progress, a global leader in application development, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Enterprises today are rapidly adopting the cloud, while continuing to retain business-critical/sensitive data inside the firewall. This is creating two separate data silos – one inside the firewall and the other outside the firewall. Cloud ISVs oft...
SYS-CON Events announced today that Outscale will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Outscale's technology makes an automated and adaptable Cloud available to businesses, supporting them in the most complex IT projects while controlling their operational aspects. You boost your IT infrastructure's reactivity, with request responses that only take a few seconds.